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Integrated Circuit Surface Measurement of Etched Characters and Warpage
Circuit boards and electronic components are marked with permanent, solder-resistant and machine-readable laser markings. The task in this case is to measure these markings to ensure they conform to specification and would not be subject to breakthrough when back grinding and to measure warpage caused by the marking process.

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In this issue, we summarise a measurement report that studies, using the Bruker Alicona InfiniteFocusSL measurement system, the 2D and 3D measurement of identification marks and warpage on an Integrated Circuit Strip.
