3D measurement of wire bonders and solder paste print
InfiniteFocus in micro electronics
InfiniteFocus is used in processing of uncased components by measuring form and orientation of wire bonders. Users measure angle, distance, diameter etc. of the sensitive connection areas. The large vertical scan range allows measurement of very large or high components.|
Measure boreholes on PCB-plates By measuring the dimensional accuracy of bore holes it is also ensured that the surface is homogeneous. Quick results and simple usage InfiniteFocus measures small details across large measurement ranges. Users achieve the maximum quality assurance with a minimum of effort. Micro-Vias Non-contact diameter, volume, depth etc. measurement of Micro-Vias on printed circuit boards. |
![]() |
Measure the SMD assembling in 3D
Verify form and orientation of wire bonders in 3D without destruction
More applications of InfiniteFocus in micro electronics
|
Roughness and form measurement devices of the InfiniteFocus line
The measurement systems of the InfiniteFocus line are roughness and form measurement devices for quality assurance in the lab and in production. All measurement systems work within the area based technique Focus-Variation. The InfiniteFocus product group comprises the standard measurement system InfiniteFocus and a series of industry specific variants:- InfiniteFocus-Standard for surface measurement including form measurement
- InfiniteFocus-Real3D for a full form measurement via 360° rotation
- IF-Portable for mobile measurement of large components and platens
- IF-EdgeMaster for cutting edge measurement and hob measurement
- IF-ToolPrecision for automatic and high resolution measurement of tap tools
- IF-Robot for surface measurement with a measuring robot
- IF-Sensor for measurement of roughness, form and orientation in the production line



