Solutions in Electronics
The electronic industry faces the ever increasing need of producing highly complex components. Regardless of their end use, electronic parts need to be faster, stronger, more compact and more universal. Amongst others, welding and soldering processes are crucial due to the likelihood of causing lumps or other failures. Automatic and accurate optical surface measurement ensures increased quality assurance.
- Automatic measurement of solder joints contacts, used in e.g. hybrid circuit and printed circuit board industry
- Automatic measurement of welding spots, e.g. inspection of various adjustment mechanisms
- Form, roughness and volume measurement of handy plug-in
- 3D surface measurement and characterization of connectors
- 3D measurement of die casting to optimize moulding
- Automatic lump detection
- Robust measurement of layer thickness
- Diameter measurement of MicroVia in PCBs
- Wear analysis of relais contacts
- 3D surface measurement of solder stencils
- Surface measurement of carbon brushes
- Measurement of transponder folding
- Automated critical dimension measurement of waver
- Surface/Roughness measurement of wire bonds
- Inspection of diamond discs
- Width and height measurement of conductive traces on PCB
- Geometry measurement
- Measurement of conductor-to-space spacing
- Measurement of pad-to-conductor spacing
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